As an example, one of the procedures found in the IPC-7721 describing PCB repairs tools and techniques, “Repair of Printed Wiring Boards” is the PCB pad replacement technique. The IPC 7721 4.5.1 Land Repair, Epoxy Method and the 4.5.2 Land Repair, Dry Film Method, both get to the same end result-the replacement of a land which has been removed usually after a rework process has been done incorrectly or handling damage.

Both methods refer to the following materials: Cleaner, microscope, soldering iron, tweezer, and wipes. Then in each of the methods, specific materials specific to that method-namely adhesive, circuit frames, and adhesive film are spelled out in the detailing of each technique. Each of the process steps is enumerated in detail so that both the PCB repair process steps and the materials can be used to complete the repair.


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